Semiconductor company Micron Technology (NASDAQ: MU) has raised its planned US investment to more than US$250 billion through 2035, including up to US$3 billion to strengthen the domestic semiconductor supply chain.

The expanded programme covers fabrication plants and technology development, as Micron works towards producing 40% of its DRAM in the US.

The company has also marked the first concrete pour at its Clay, New York, manufacturing site, more than a quarter ahead of schedule. The milestone moves the project from site preparation into vertical construction.

“Today’s milestone marks another major step for Micron in Central New York, and what makes it even more remarkable is that we’re here in July, months ahead of schedule, pouring the concrete foundation,” said New York Governor Kathy Hochul.

She added that the development represented the largest private investment in the state’s history and could support up to 50,000 jobs.

Less than six months after breaking ground in January 2026, Micron has completed early site works and begun moving into vertical construction at the New York fab.

Bechtel has been selected as the engineering, procurement, and construction partner for the first facility, alongside architectural and engineering design partner Jacobs and preconstruction and site infrastructure contractor Gilbane Building Company.

Micron said around US$675 million, or more than half of the value awarded so far, had gone to New York-based contractors, suppliers, and subcontractors. More than 80% of workers on site to date have been state residents.

The wider development could include up to four fabs and is expected to create 50,000 jobs in New York, including 9,000 direct Micron roles.

The New York project forms the centrepiece of Micron’s US investment plan. In Idaho, the company expects first wafer output from its two fabs in mid-2027 and late 2028, respectively.

Micron has also begun initial production of its 1-alpha DDR4 technology in Virginia for automotive, industrial, medical, aerospace, and defence customers.

Together, the US projects are expected to support more than 90,000 jobs. Micron said it would adjust its supply plans in line with market conditions.

GlobalWafers partnership

As part of the US$3 billion supply-chain programme, Micron plans to provide GlobalWafers with US$500 million in financing to support its 300mm raw silicon wafer facility in Sherman, Texas.

The companies also plan to enter a 10-year supply agreement giving Micron access to silicon wafer capacity for its US manufacturing expansion.

“Securing a reliable supply of critical input materials is essential to supporting Micron’s long-term growth and technology roadmap,” said Ben Tessone, senior vice-president and chief procurement officer at Micron Technology.

Tessone said the investment would improve supply security and support the expansion of domestic semiconductor manufacturing capacity.

Micron and GlobalWafers also plan to explore collaboration on next-generation wafer technologies and manufacturing processes.

GlobalWafers chairperson and chief executive Doris Hsu said the agreement would deepen the companies’ partnership and support the supply of raw silicon wafers.

GlobalWafers is currently the only raw silicon wafer supplier participating in the CHIPS for America programme that is capable of producing advanced 300mm wafers in the US, according to Hsu.

The partnership would help meet wafer demand while expanding US manufacturing capacity and improving supply-chain resilience, she added.

The proposed transaction remains subject to definitive agreements, regulatory approvals and other closing conditions.

Micron develops DRAM, NAND and NOR memory and storage products for data centres, edge computing, mobile devices and other compute-intensive applications.